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JPCA Show
Event time:
2024-06-12 09:00 ~ 2024-06-14 16:30
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Exhibition details
| Exhibitions | PWB Tech 2024 Module Japan 2024 Flexible Printed Circuits Products Area EMS Japan 2024 |
|---|---|
| Organizer | Japan Electronics Packaging and Circuits Association (JPCA) |
| Aim | Our objective is to contribute to the advancement of the electronic circuit industry and all related fields by presenting an exhibition of products, knowledge and solutions related to the electronic circuits and packaging technologies used in all electronic devices, IT devices and equipment, as well as the design, testing and logistics of large electronics (printed electronics, stretchable electronics, etc.). |
|---|---|
| Exhibition Period | Wednesday – Friday, June 12-14, 2024. 10:00 a.m. to 5:00 p.m. |
| Venue | Tokyo Big Sight East Exhibition Halls |
| Entrance Fee | JPY1,000 (Tax included) * Free Adminssion for visitors with invitations and those who have pre-registered online. |
PWB Tech 2024
| Products | Single-sided, double-sided, and multi-layered printed wiring boards, flexible printed wiring boards, build-up wiring boards, flex-rigid printed wiring boards, ceramic wiring boards, metal (copper, aluminum, etc.) based printed wiring boards, other printed wiring boards, and related books, etc. |
|---|---|
| Design Technologies | Functional design (circuit design for functional requests) technology, logical design (circuit diagram design) technology, parts layout design and bill of materials, pattern design, layout design, structure design, various design support tools (for the above listed technologies), signal integrity design support tools, power integrity design support tools, electromagnetic field analysis (measures for EMC/EMI/SI), electrical, mechanical, and thermal property simulators, CAE devices such as CAD, CAM, CIM, and related books, etc. |
| Reliability and Inspection Technologies | Inspection and assessment contract services, various kinds of inspection devices, various testing devices, evaluation/analysis systems, inspection jigs, and related books, etc. |
| Main Materials | Rigid copper clad laminates (CCLs), flexible copper clad laminates (FCCLs), shield boards, multi-layer PWB prepregs, copper foil with adhesive, ceramic board materials, copper/aluminum board materials, special board materials, various insulating materials, solder mask materials, and related books, etc. |
| Processing Technologies, Materials and Equipment | Plating, mold casting, hole drilling, plate making, plating chemicals, surface processing chemicals, etching chemicals, various inks, pastes, various tools, dry film resist, and related books, etc. |
| Manufacturing Equipment | Chemical processing device, photolithography exposure equipment, machining equipment, transportation equipment, coating equipment, plasma processing equipment, laser processing devices, printing equipment, and related books, etc. |
| Environmental Systems | Water pollution control system, waste material and liquid processing, global-warming prevention system, air pollution control system, land contamination prevention system, noise control system, energy conservation system, CO2 reduction system, heat utilization (such as heat exchangers/waste heat utilization systems/thermal storage systems), and related books, etc. |
| Distribution Systems | Transportation, packaging and packing equipment, embossed carriers, trays, tubes, internal and external boxes, logistics system, transportation system, trade control service, procurement and commissioned production, ordering system, drawing and documentation control systems, security systems, inventory control systems, traceability control, warehouse control system, intellectual property management systems, IT solutions, and related books, etc. |
Module Japan 2024
| Products | Rigid substrate, build-up substrate, tape substrate, COF/TAB, ceramic substrate, lead frame, wafer-level package, two-dimensional package (SiP), three-dimension packages, silicon interposer, glass interposer, MEMS interposer (with rewiring layer), functional layer interposer, rigid active device embedded substrate, flexible active device embedded substrate, rigid passive device embedded substrate, flexible passive device embedded substrate, module device embedded substrate, IPD device embedded substrate, MEMS device embedded substrate, LTCC, bare dies, WLCSP/WLP, BGA (CSP), LGA, QFN, Chip parts, complex chip parts, IPD, modules of various types, MEMS, books on related topics, and related books, etc. |
|---|---|
| Design Technologies | Functional design (circuit design for functional requests) technology, logical design (circuit diagram design) technology, parts layout design and bill of materials, pattern design, layout design, structure design, various design support tools (for the above listed technologies), signal integrity design support tools, power integrity design support tools, electromagnetic field analysis (measures for EMC/EMI/SI), electrical, mechanical, and thermal property simulators, CAE devices such as CAD, CAM, CIM, and related books, etc. |
| Reliability and Inspection Technologies | Inspection and assessment contract services, various kinds of inspection devices, various testing devices, evaluation/analysis systems, inspection jigs, and related books, etc. |
| Main Materials | Core multi-layered PWBs, organic package substrate materials, various alloys (Fe-Ni, Cu), polyimide film/tape, ceramic board materials, silicon wafers, glass blanks, organic/inorganic rewiring layer and materials, metal plates/radiator plates, metal stiffener plates, semiconductor insulating layer materials, optical wave guide materials, solder mask materials, organic/inorganic board (insulating) materials, copper foil carriers, film carriers, and related books, etc. |
| Processing Technologies, Materials and Equipment | Plating, mold casting, hole drilling, plate making, plating chemicals, surface processing chemicals, etching chemicals, various inks, pastes, various tools, dry film resist, die bonding materials, bonding wire, solder balls, bump materials, metal barrier materials, sealing resin, underfill, coating materials, various adhesives agents, conductive/nonconductive film, conductive/nonconductive paste, metal masks, and related books, etc. |
| Manufacturing Equipment | Chemical processing device, photolithography exposure equipment, machining equipment, transportation equipment, coating equipment, cleaning equipment, back-grinding equipment, CMP equipment, dicing equipment, wire bonders, die bonders, flip chip bonder, dispenser, plasma processing equipment, laser drilling equipment, RIE (Reactive Ion Etching) equipment, laser marking equipment, laser trimming machine, thermosetting device, printing equipment, and related books, etc. |
| Environmental Systems | Water pollution control system, waste material and liquid processing, global-warming prevention system, air pollution control system, land contamination prevention system, noise control system, energy conservation system, CO2 reduction system, heat utilization (including heat exchangers/waste heat utilization systems/thermal storage systems) and related books, etc. |
| Distribution Systems | Transportation, packaging and packing equipment, embossed carriers, trays, tubes, internal and external boxes, logistics system, transportation system, trade control service, procurement and commissioned production, ordering system, drawing and documentation control systems, security systems, inventory control systems, traceability control, warehouse control system, intellectual property management systems, IT solutions, and related books, etc. |
EMS Japan 2024
| Products | Printed wiring mount board (printed wiring board on which electronic components are mounted and electrically interconnected; eg., AV or digital home appliances, mobile devices, automobiles, PCs and PC peripherals, household appliances and industrial equipment, and motherboards for powered devices), mounted module substrate (a module substrate on which electronic components are mounted and electrically interconnected; eg., AV and digital home appliances, mobile devices, automobile, PCs and PC peripherals, household appliances and industrial equipment, and module boards and IC packages for powered devices), insertion device mounted board, chip component mounted board, IC package mounted board, wire bonding mounted board, TAB/COF mounted board, flip chip mounted board, other electronic circuit boards, memory and storage devices, general-purpose logic ICs, transistors, diodes, optical semiconductors, sensor/imagining elements, high-frequency devices, microcomputers, ASIC, specific-purpose ICs (for use in TVs, AV equipment, communications equipment, in-car devices, and peripherals), general-purpose linear ICs (power supply ICs, motor drivers, LED drivers, transistor arrays, operational amplifiers and comparators, intelligent power devices (IPD), etc.), and related books, etc. |
|---|---|
| Design Technologies | Packaging and structural design technologies, functional design technologies, logical design technologies, part layout design technologies, bill of materials (BOM), pattern design, layout design, various design support tools, 2D CAD, 3D CAD, digital mock-up tools, knowledge management systems, plotters/printers, CAM, process simulators, CAE (mechanism analysis, structure analysis, thermo-fluid analysis, resin flow analysis, casting analysis, electromagnetic field analysis, press analysis), analyzing service by contract, and related books, etc. |
| Reliability and Inspection Technologies | Electronic circuit mounted board/ semiconductor integrated circuit inspection and assessment contract services, various kinds of electronic circuit mounted board and semiconductor integrated circuit inspection devices, various kinds of electronic circuit mounted board and semiconductor integrated circuit testing devices, various kinds of electronic circuit mounted board and semiconductor integrated circuit evaluation and analysis systems, burn-in devices, logical testing devices, memory test devices, linear testing systems, inspection jigs, testing, inspection and assessment contract services, and related books, etc. |
| Main Materials | Electronic circuit boards, module substrates, wafers, mask materials, solder, lead frames, molding compounds, packaging materials, product structural components, other main materials used in the manufacture of electronic circuit mounted boards, development services by consignment, and related books, etc. |
| Manufacturing Equipment, and Processing Materials and Equipment | Processing equipment and materials such as agents, chemicals, pastes, films, jigs and tools for manufacturing printed wiring mounted boards (including for processes such as mounting, embedding, insertion and assembly of parts and devices), processing equipment and materials such as agents, chemicals, pastes, films, jigs and tools for manufacturing mounted module substrates (for processes such as die layering and stacking, embedding and assembly, dicing, bonding, packaging, sealing, marking, soldering and other mounting and assembly processes), processing equipment and materials such as agents, chemicals, pastes, films, jigs and tools for manufacturing semiconductor integrated circuits (for processes such as single-crystal processing/exposure, depiction/resist processing/etching/heat treatment/ thin film formation/ion implantation/ washing and drying, etc.), various types of machine tools for device production, casting, defining/washing equipment, various transportation systems and equipment, pure water/ liquid agent/water treatment equipment, various types of gas devices, clean rooms, control equipment, FA systems, and related books, etc. |
| Environmental Systems | Water pollution control system, waste material and liquid processing, global-warming prevention system, air pollution control system, land contamination prevention system, noise control system, energy conservation system, CO2 reduction system, heat utilization (including heat exchangers/waste heat utilization systems/thermal storage systems) and related books, etc. |
| Distribution Systems | Transportation, packaging and packing equipment, embossed carriers, trays, tubes, internal and external boxes, logistics system, transportation system, trade control service, procurement and commissioned production, ordering system, drawing and documentation control systems, security systems, inventory control systems, traceability control, warehouse control system, intellectual property management systems, IT solutions, and related books, etc. |
Leading-edge products based on high-density or high-frequency packaging technologies, high-density substrate and interposers, component contained boards, semiconductor chips, systems in package (SiP), systems on chip (SoC), indication/optical devices and sensors, materials related to high-density packaging, pastes, lead-free solder and junction materials, sealing resins, adhesives,, and underfill materials, anti-heat materials, high frequency ready polymer, systems and devices related to high-density packaging such as bonders (e.g. wire bonders, die bonders, and LCD/COG bonders), dispensers, flip chip (FC) packaging, BGA/CSP assembly, TAB packaging, OLB/ILB systems, and COB systems and equipment and production facilities, and related books, etc.
| Electronic Component Placement Machines and related Equipment and Systems | Electronic component placement machines, electronic component insertion machines, screen printers, soldering equipment (reflow oven), and dispensers |
|---|---|
| Packaging related Equipment and Systems | Transfer systems, taping machines and materials, bulk feeders and other feeders, and automatic assembly machines |
| Semiconductor Packaging Machines and Systems | Wire bonders, die bonders, flip chip packaging systems, LCD/COG bonding systems, BGA/ILB systems, and COB systems |
| Inspection/Test Equipment | Automated optical inspection equipment, inspection/measuring equipment associated with semiconductor manufacturing, and inspection/measuring equipment associated with other packaging |
| Packaging Design Systems | Design tools, production optimizing software, and packaging programming devices |
| Packaging Devices/Components and related Materials | SMD, semiconductor package parts, small electronic parts, chip parts, connectors, sockets, switches, and bulk supplies |
| Packaging Device Packaging Materials | Taping reels, carrier tape, TAB tape/reel, magazine sticks, IC trays, and bulk cases |
| Packaging Joining Systems | Soldering devices, solder/joining materials, and underfill materials |
| High Frequency Compatible Devices, Components, and Materials | Devices, components, and materials |
| Environment related Devices and Materials | Devices and materials associated with the zero emission process and waste treatment recovery |
| Publications | Related books in every field |
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